SAE AMS2690 Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates (NONCURRENT Apr 2001)
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Product Code:SAE AMS2690
Title:Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates (NONCURRENT Apr 2001)
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.
Title:Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates (NONCURRENT Apr 2001)
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.
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